To date, SMA Fellows have published 366 articles in 289 journals while 51 articles have been accepted for publication in 43 journals. Some articles are listed under more than one category.

TiNi Shape Memory Alloy Thin Films for MEMS Applications

Journal Publications

1. Fu Y. Q. & Du H. J., “Magnetron Sputtered TiNiCu Shape Memory Alloy Thin Film for MEMS Applications”, Materials and Process Integration for MEMS, pp. 71-87 (2002).
   
   
2. Fu Y. Q., Du H. J. & Zhang S., “TiNi SMA Thin Films: Relationship Among Processing, Stress Evolution and Transformation Properties”, Surface and Coatings Technology, Vol. 167, No. 2-3, pp. 120-128 (2003).
   
   
3. Fu Y. Q. & Du H. J., “Effects of Film Composition and Annealing on Residual Stress Evolution for Shape Memory TiNi Film”, Materials Science and Engineering A, Vol. 342, Issues 1-2, pp. 237-245 (2002).
   
   
4. Fu Y. Q., Du H. J & Zhang S., “Application of TiNi Layer on TiNi Film to Improve Its Surface Properties”, Surface and Coatings Technology, Vol. 167, No. 2-3, pp. 129-136 (2003).
   
   
5. Fu Y. Q., Du H. J. & Sun C. Q., “Interfacial Structure, Residual Stress and Adhesion of Diamond Coating on Titanium”, Thin Solid Films, Vol. 424, No. 1, pp. 107-114 (2003).
   
   
6. Fu Y. Q., Du H. J., Gao S. & Yi S., “Mechanical Properties of TiNi Shape Memory Alloy Thin Films”, Materials Science Forum, Vol. 437, No. 4, pp. 37-40 (2003).
   
   
7. Fu Y. Q., Du H. J., Huang W. & Hu M., “TiNi Film Based Shape Memory Alloy and Actuators”, International Journal of Computational Engineering Science (IJCES), Vol. 4, pp. 221-225 (2003).
   
   
8. Fu Y. Q., Du H. J. & Zhang S., “Interfacial Structure and Adhesion of TiNi Films on Si/SiO2 Substrate”, Thin Solid Films, Vol. 444, pp. 85 (2003).
   
   
9. Fu Y. Q. & Du H. J., “Magnetron Sputtered TiNiPt10 Shape Memory Alloy Thin Films”, Journal of Materials Science Letters, Vol. 22, pp. 531-533 (2003).
   
   
10. Du H. J. & Fu Y. Q., “Deposition and Characterization of TiNiCuX Shape Memory Alloy Thin Films”, Surface and Coatings Technology, Vol. 176, pp. 182-187 (2004).
    
    
11. Fu Y. Q., Du H., Huang W. M., Zhang S. & Hu M., “TiNi-Based Thin Films in MEMS Applications: A Review”, Sensors and Actuators A Physical, Vol. 112, pp. 395-408 (2004).
    
    
12. Fu Y., Du H., Zhang S. & Ong S. E., “Effects of Silicon Nitride Interlayer on Phase Transformation and Adhesion of TiNi films”, Thin Solid Films, Vol. 476, pp. 352-357 (2005).

Conference Publications

1. Fu Y. Q. & Du H. J., “Stress Generation and Recovery During Martensite Transformation for TiNi Films”, International Conference on Martensite Transformations 02, Helsinki, Finland, 9-14 June 2002.
   
   
2. Fu Y. Q. & Du H. J., “Magnetron Sputtered TiNiCu Shape Memory Alloy Thin Films with Different Cu Contents”, SPIE’s International Symposium on Smart Materials, Smart Materials II, SPIE, Nano- and Micro Smart Systems, pp. 219-225, Melbourne, Australia, 16-18 December 2002.
   
   
3. Fu Y. Q. & Du H. J., “Fabrication of Micromachined TiNi-Based Microgripper with Compliant Structure”, Proceedings of the SPIE - The International Society for Optical Engineering, Vol. 5116, pp. 38-47, Smart Sensors, Actuators, and MEMS, Maspalomas, Gran Canaria, Spain, SPIE-Int. Soc. Opt. Eng, USA, 19-21 May 2003.
   
   
4. Fu Y. Q., Du H. J. & Zhang S., “Some Considerations on TiNi films for MEMS Applications”, The 8th IUMRS International Conference on Advanced Materials (IUMRS-ICAM 2003), Yokohama, Japan, 8-13 October 2003.
   
   
5. Chen J., Fu Y. Q., Du H. J. & Zhang S., “TiNi1-xCux Shape Memory Alloy Thin Films for Biopsy Application”, Proceedings of International Conference on Precision Engineering (ICoPE2003/04), pp. 579-586, Singapore, 2-5 March 2004.
   
   
6. Du H. & Fu Y. Q., “Preparation of TiNiCu Thin Films for Biopsy Applications in Microcapsule Endoscopy”, SPIE International Symposium on Smart Materials, Nano- and Micro-Smart Systems, Sydney, Australia, 12-15 December 2004 (invited paper).